Telecommunications Optical Channel Multiplexer
Early Design Concept of VMUX
(Modeled in SolidWorks)

Actual Device Advertisement
(WDM magazine)

  • Integration of AWG and 40 Ch. VOA modules into single module.
  • Designed for optimal heat dissipation (free convection) into customer defined footprint.
  • flex circuit interconnects to integrated motherboard.
  • high density wire bond interconnect to VOA chip.
  • AWG and VOA chip mounts design for rapid low stress assembly.
  • Thermal isolation for AWG and heat dissipation for VOA in single unit.

Award for "Thermal, Interconnect and Package Design"
SDL-PIRI Nov 2000