hybrid Kovar and HTCC ceramic package.
High density ceramic and Tungsten PCB hermetic fead throughs with
dual integrated PGA connectors.
heatsink design via
natural convection heat pump through internal fins.
to eliminate optical fiber snags and breaks during installation.
component and external optical components integrated into small
- Power supply
PCB, 2 Drive PCBs, digital signal processor PCB, hermetic package,
external optics and fiber routing all integrated in 13mm tall package
light pipes incorporated for user interface.